Effect of temperature on the evolution of diffusivity, microstructure and hardness of nanocrystalline nickel films electrodeposited at low temperatures

被引：15

作者：

Chung, C. K. ^{[1
]}

Chang, W. T. ^{[1
]}

Chen, C. F. ^{[1
]}

Liao, M. W. ^{[1
]}

机构：

[1] Natl Cheng Kung Univ, Ctr Micro Nano Sci & Technol, Dept Mech Engn, Tainan 701, Taiwan

来源：

MATERIALS LETTERS | 2011年 / 65卷 / 03期

关键词：

Electrodeposition; Nickel; Hardness; Atomic force microscopy; Diffusion coefficient;

D O I：

10.1016/j.matlet.2010.10.064

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Most nickel (Ni) films galvanostatically electrodeposited at 40-50 degrees C exhibited low hardness about 4 GPa and rough surface. In this article, we have investigated Ni electrodeposition at low temperatures of 5-20 degrees C in order to enhance the hardness and smoothness of films and performed by potentiostatic mode instead of galvanostatic mode to avoid the low-temperature precipitation of electrolyte agents. Effect of temperature on the evolution of diffusion coefficient, deposition rate, morphology and hardness was studied. Electrodeposition at low temperature without hard-element addition can reduce diffusion rate and produce the finegrain, smooth morphology and dense film together with compressive residual stress to enhance hardness up to 6.18 GPa at 5 degrees C. The growth and hardening mechanism, of low-temperature electrodeposited Ni were further discussed in details. (C) 2010 Elsevier B.V. All rights reserved.

引用

页码：416 / 419

页数：4

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