Interpretation of microstructure evolution during self-annealing and thermal annealing of nanocrystalline electrodeposits-A comparative study

被引:20
|
作者
Pantleon, Karen [1 ]
Somers, Marcel A. J. [1 ]
机构
[1] Tech Univ Denmark, Dept Mech Engn, DK-2800 Lyngby, Denmark
来源
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2010年 / 528卷 / 01期
关键词
X-ray diffraction; Nanostructured materials; Electrochemical deposition; Grain growth; ABNORMAL GRAIN-GROWTH; STABILITY; NICKEL; CU; IMPURITIES; HYDROGEN; KINETICS;
D O I
10.1016/j.msea.2010.04.077
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Electrodeposition results in a non-equilibrium state of the as-deposited nanocrystalline microstructure, which evolves towards an energetically more favorable state as a function of time and/or temperature upon deposition. Real-time investigation of the evolving microstructure in copper, silver and nickel electrodeposits was achieved by time-resolved X-ray diffraction line profile analysis and crystallographic texture analysis during room temperature storage and during isothermal annealing at elevated temperatures. These in-situ studies with unique time resolution allowed quantification of the self-annealing kinetics of copper and silver electrodeposits as well as the annealing kinetics of electrodeposited nickel. Similarities and characteristic differences of the kinetics and mechanisms of microstructure evolution in the various electrodeposits are discussed and the experimental results are attempted to be interpreted in terms of recovery, recrystallization and grain growth. (C) 2010 Elsevier B.V. All rights reserved.
引用
收藏
页码:65 / 71
页数:7
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