Trap induced negative differential conductance and back-gated charge redistribution in AlGaN/GaN power devices

被引:1
作者
Binder, Andrew T. [1 ]
Yuan, Jiann-Shiun [1 ]
Krishnan, Balakrishnan [2 ]
Shea, Patrick M. [3 ]
Yeh, Wen-Kuan [4 ]
机构
[1] Univ Cent Florida, Dept Elect & Comp Engn, Orlando, FL 32816 USA
[2] BRIDG, Neocity, FL 34744 USA
[3] Intersil Corp, Palm Bay, FL 32905 USA
[4] Natl Nano Device Lab, Hsinchu, Taiwan
关键词
GaN HEMTs; Negative differential conductance; Power devices; Trap induced phenomenon; CURRENT-COLLAPSE; GAN; HEMTS;
D O I
10.1016/j.microrel.2019.113495
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Negative differential conductance (NDC) seen in the drain current saturation region is typically attributed to self-heating effects in GaN HEMTs. In this paper, it is demonstrated that NDC is due to trap states in the buffer resulting from poor carrier confinement in the channel during saturation which leads to stray electrons exiting the channel and becoming trapped. Substrate bias testing has been used to confirm that severe current collapse occurs when those electrons are forced to the surface, and that NDC occurs when the carriers are forced to the buffer. In addition to this, pulsed I-V characterization is performed among other tests to isolate the cause of NDC in the saturation region, which effectively eliminated trapping mechanisms that lead to gate- and drain-lag from contributing to NDC. To the best of our knowledge, we are the first to report NDC not as a result of self-heating, but due to trapping within the buffer.
引用
收藏
页数:6
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