Novel surface-micromachined low-power fuses for on-chip calibration

被引：0
|
作者：
Maier-Schneider, D [1 ]
Kolb, S [1 ]
Winkler, B [1 ]
Werner, W [1 ]
机构：
[1] Infineon Technol AG, WS GS SNS D3, D-81739 Munich, Germany
来源：
TRANSDUCERS '01: EUROSENSORS XV, DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2 | 2001年
关键词：
low-power fuse; surface micromachining; sensor calibration;
D O I：
暂无
中图分类号：
R318 [生物医学工程];
学科分类号：
0831 ;
摘要：
A novel low-power polysilicon fuse of high reliability was developed. The power consumption is so small that the fuse can be blown with an on-chip circuit. The fuse can be blown with high yield by voltage pulses of an amplitude of approx. 4V and a blowing current of 20...40mA. The fuse is typically blown after 1 mus. The total energy consumption amounts to 110 nJ. The resistance changes by more than 8 decades. Because of its low power consumption the fuse can be used to realize an on-chip programmable PROM. This offers the possibility to calibrate chips after mounting and packaging. This paper describes the fuse itself and its application for the calibration of micromechanical sensors after packaging.
引用
收藏
页码：92 / 95
页数：4
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