Kinetic Monte Carlo Approach to the Effects of Additives in Electrodeposition

被引：2
|
作者：
Kaneko, Y. [1 ]
Hiwatari, Y. [2 ]
Ohara, K. [3 ]
Asa, F. [3 ]
机构：
[1] Kyoto Univ, Grad Sch Informat, Dept Appl Anal & Complex Dynam Syst, Kyoto 6068501, Japan
[2] Toyota Phys & Chem Res Inst, Nagakute, Aichi 4801192, Japan
[3] C Uyemura & Co Ltd, Hirakata, Osaka 5730065, Japan
来源：
COMPUTATIONAL ELECTROCHEMISTRY | 2011年 / 35卷 / 27期
关键词：
SHAPE EVOLUTION; SIMULATION;
D O I：
10.1149/1.3643347
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
The effects of additives in copper electrodeposition have been studied by using the multi-scale kinetic Monte Carlo simulation. Recently we have extended the solid-by-solid model for crystal growth to a multiple scale model for the simulation of the copper deposition from electrolytic solution. The system consists of the electrode, the solution and the diffusion layer. The solution contains copper ions and the model additives of chloride ions, polyethylene glycol (PEG) and bis(3-sulfopropyl) disulfide (SPS). We have performed the simulations of copper deposition with different combinations of the additives and studied the surface morphology. The suppressing effect of PEG and the accelerating effect of SPS have been confirmed.
引用
收藏
页码：7 / 12
页数：6
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