MEMS and mil/aero .... technology push and market pull

被引:1
作者
Clifford, T
机构
来源
MEMS DESIGN, FABRICATION, CHARACTERIZATION, AND PACKAGING | 2001年 / 4407卷
关键词
D O I
10.1117/12.425286
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
MEMS offers attractive solutions to high-density fluidics, inertial, optical, switching and other demanding military/aerospace (mil/aero) challenges. However, full acceptance must confront the realities of production-scale producibility, verifiability, testability, survivability, as well as long-term reliability. Data on these "..ilities" are crucial, and are central in funding and deployment decisions. Similarly, mil/aero users must highlight specific missions, environmental exposures, and procurement issues, as well as the quirks of its designers. These issues are particularly challenging in MEMS, because of the laws of physics and business economics, as well as the risks of deploying leading-edge technology into no-fail applications. This paper highlights mil/aero requirements, and suggests reliability / qualification protocols, to guide development effort and to reassure mil/aero users that MEMS labs are mindful of the necessary realities.
引用
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页码:1 / 9
页数:9
相关论文
共 18 条
[1]   Dynamic high-g loading of MEMS sensors: Ground and flight testing [J].
Brown, TG ;
Davis, BS .
MATERIALS AND DEVICE CHARACTERIZATION IN MICROMACHINING, 1998, 3512 :228-235
[2]   Accurate method for determining adhesion of cantilever beams [J].
de Boer, MP ;
Michalske, TA .
JOURNAL OF APPLIED PHYSICS, 1999, 86 (02) :817-827
[3]  
GEORGE T, MEMS TECHNOLOGY NASA
[4]  
JENNINGS U, 2000, SPIE, V4180
[5]  
Jensen BD, 1999, 1999 INTERNATIONAL CONFERENCE ON MODELING AND SIMULATION OF MICROSYSTEMS, P206
[6]  
*LUC LAB, 2000, SPIE, V4180
[7]  
Madou M., 1997, Fundamentals of Microfabrication
[8]  
*MITS, 2000, FAIL MECH SEM DEV
[9]  
*OMM INC, 2000, EMS NEW OPT SOL OPT
[10]  
SNIEGOWSKI JJ, 1998, 2 INT C ENG DES AUT