Gapfill Study of Polyimides for MEMS Applications

被引：0

作者：

Jang, Steven Lee Hou ^{[1
]}

Ming, Tan Wee ^{[1
]}

Mao Yingjun ^{[1
]}

Murthy, Ramana ^{[1
]}

Nagarajan, Ranganathan ^{[1
]}

机构：

[1] ASTAR, Inst Microelect, Singapore 117685, Singapore

来源：

NEMS/MEMS TECHNOLOGY AND DEVICES | 2011年 / 254卷

关键词：

polyimide; MEMS; gapfill; spin-coating; CMP;

D O I：

10.4028/www.scientific.net/AMR.254.54

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Various types of polyimide have been used widely in the manufacturing of integrated circuits and MEMS' (Micro Electrical Mechanical Systems) such as sensors. These organic spin-on polymers exhibit a wide range of mechanical and electrical properties and have been commonly used for electrical insulation as well as device passivation and protection. In addition, these organic spin-on polymers serve as excellent sacrificial materials for forming cavities on MEMS structures. This work studies the gapfill properties of several polyimides after spin-coating and curing. In addition, this work examines and compares the gapfilling and planarization properties of a number of different polyimides, including multiple layers of polyimides for gapfilling and planarization.

引用

页码：54 / 57

页数：4