Suppression of Power/Ground Noise Using Meshed-Planar Electromagnetic Bandgap (MP-EBG) Structure for Ultra-Wideband (UWB) System-in-Package (SiP)

被引：5
|
作者：
Kim, Myunghoi [1 ]
Yoon, Changwook [1 ]
Koo, Kyoungchoul [1 ]
Hwang, Chulsoon [1 ]
Sung, Hajin [1 ]
Kim, Joungho [1 ]
机构：
[1] Korea Adv Inst Sci & Technol, Dept EE, Terahertz Interconnect & Package Lab, Taejon 305701, South Korea
来源：
2010 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC 2010) | 2010年
关键词：
TRANSMITTER; DESIGN;
D O I：
10.1109/ISEMC.2010.5711241
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, we propose the meshed-planar electromagnetic bandgap (MP-EBG) structure with a meshed planar surface embedded in the package power plane to suppress a power/ground noise in the frequency range from 3.1GHz to 10.6GHz, also known as the frequency band of Ultra-Wideband (UWB). The MP-EBG structure has two different EBG surfaces. One surface is a mushroom-like surface embedded between a package power and a ground plane and the other surface is a meshed planar structure embedded in a package power plane. The MP-EBG structure enables to enhance the bandwidth of the stopband in the limited package area and achieve the 8.7GHz stop bandwidth with -30dB isolation.
引用
收藏
页码：28 / 31
页数：4
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