In situ ellipsometric study of PEG/Cl- coadsorption on Cu, Ag, and Au

被引:71
作者
Walker, ML [1 ]
Richter, LJ
Moffat, TP
机构
[1] NIST, Chem Sci & Technol Lab, Gaithersburg, MD 20899 USA
[2] NIST, Mat Sci & Engn Lab, Gaithersburg, MD 20899 USA
关键词
D O I
10.1149/1.1915271
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
Spectroscopic ellipsometry was used to examine the adsorption of poly(ethylene glycol) (PEG) and Cl- on polycrystalline Cu, Ag, and Au electrodes in sulfuric acid. In halide-free sulfuric acid, PEG adsorption on Cu and Ag is minimal at potentials positive of the estimated potential of zero charge (pzc). PEG adsorption on Au was also negligible in halide-free environments positive of the pzc, but slight adsorption was evident near the pzc. In contrast, in the presence of adsorbed halide, PEG coadsorption is clearly evident at potentials near or positive of the pzc for all metal samples studied. The PEG/Cl- coadsorbed film does not provide a significant barrier to outer-sphere electron-transfer reactions [i.e., Ru3+/(2+) (NH3)(6)], although inner-sphere reactions associated with electrodeposition of copper are effectively inhibited. The implications of these observations with respect to the role of Cu+ ions in the PEG-induced inhibition of Cu electrodeposition is discussed. (c) 2005 The Electrochemical Society. All rights reserved.
引用
收藏
页码:C403 / C407
页数:5
相关论文
共 33 条
[21]  
MARTENSSON J, 1995, LANGMUIR, V11, P963
[22]   Electrodeposition of copper in the SPS-PEG-Cl additive system - I. Kinetic measurements: Influence of SPS [J].
Moffat, TP ;
Wheeler, D ;
Josell, D .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2004, 151 (04) :C262-C271
[23]   Superconformal electrodeposition of copper in 500-90 nm features [J].
Moffat, TP ;
Bonevich, JE ;
Huber, WH ;
Stanishevsky, A ;
Kelly, DR ;
Stafford, GR ;
Josell, D .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2000, 147 (12) :4524-4535
[24]   CHLORIDE-ION CATALYSIS OF THE COPPER DEPOSITION REACTION [J].
NAGY, Z ;
BLAUDEAU, JP ;
HUNG, NC ;
CURTISS, LA ;
ZURAWSKI, DJ .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1995, 142 (06) :L87-L89
[25]   Spectroscopic real-time ellipsometry of putidaredoxin adsorption on gold electrodes [J].
Reipa, V ;
Gaigalas, AK ;
Vilker, VL .
LANGMUIR, 1997, 13 (13) :3508-3514
[26]   On the role of poly(ethylene glycol) in deposition of galvanic copper coatings [J].
Stoychev, D .
TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 1998, 76 :73-80
[27]  
Stoychev D, 1996, J APPL ELECTROCHEM, V26, P741
[28]  
TRASATTI S, 1992, NATO ADV SCI I C-MAT, V335, P245
[30]   Void-free anisotropic deposition for IC interconnect with polyethylene glycol as the single additive based on uneven adsorption distribution [J].
Wu, BH ;
Wan, CC ;
Wang, YY .
JOURNAL OF APPLIED ELECTROCHEMISTRY, 2003, 33 (09) :823-830