Accurate Analytical Modeling for Switching Energy of PiN Diodes Reverse Recovery

被引:37
作者
Jahdi, Saeed [1 ]
Alatise, Olayiwola [1 ]
Ran, Li [1 ]
Mawby, Philip [1 ]
机构
[1] Univ Warwick, Sch Engn, Dept Elect & Elect Engn, Coventry CV4 7AL, W Midlands, England
基金
英国工程与自然科学研究理事会;
关键词
Analytical modeling; PiN diodes; reverse recovery; switching energy; switching transient; I-N-DIODES; PARAMETER EXTRACTION; POWER SEMICONDUCTORS; IGBT; MOSFETS; LOSSES; DESIGN;
D O I
10.1109/TIE.2014.2347936
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
PiN diodes are known to significantly contribute to switching energy as a result of reverse-recovery charge during turn-OFF. At high switching rates, the overlap between the high peak reserve-recovery current and the high peak voltage overshoot contributes to significant switching energy. The peak reverse-recovery current depends on the temperature and switching rate, whereas the peak diode voltage overshoot depends additionally on the stray inductance. Furthermore, the slope of the diode turn-OFF current is constant at high insulated-gate bipolar transistor (IGBT) switching rates and varies for low IGBT switching rates. In this paper, an analytical model for calculating PiN diode switching energy at different switching rates and temperatures is presented and validated by ultrafast and standard recovery diodes with different current ratings. Measurements of current commutation in IGBT/PiN diode pairs have been made at different switching rates and temperatures and used to validate the model. It is shown here that there is an optimal switching rate to minimize switching energy. The model is able to correctly predict the switching rate and temperature dependence of the PiN diode switching energies for different devices.
引用
收藏
页码:1461 / 1470
页数:10
相关论文
共 34 条
[1]  
Al-Naseem O., 2000, Proc. IEEE APEC, V1, P242
[2]   Improved Electrothermal Ruggedness in SiC MOSFETs Compared With Silicon IGBTs [J].
Alexakis, Petros ;
Alatise, Olayiwola ;
Hu, Ji ;
Jahdi, Saeed ;
Ran, Li ;
Mawby, Philip A. .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2014, 61 (07) :2278-2286
[3]   On the role of the N-N+ junction doping profile of a PIN diode on its turn-off transient behavior [J].
Allard, Bruno ;
Garrab, Hatem ;
Ben Salah, Tarek Ben ;
Morel, Herve ;
Ammous, Kaicar ;
Besbes, Katnel .
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2008, 23 (01) :491-494
[4]   Advanced SPICE modeling of large power IGBT modules [J].
Azar, R ;
Udrea, F ;
De Silva, M ;
Amaratunga, G ;
Ng, WT ;
Dawson, F ;
Findlay, W ;
Waind, P .
IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 2004, 40 (03) :710-716
[5]   IGBT and Diode Loss Estimation Under Hysteresis Switching [J].
Bazzi, Ali M. ;
Krein, Philip T. ;
Kimball, Jonathan W. ;
Kepley, Kevin .
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2012, 27 (03) :1044-1048
[6]   Reliability Analysis Framework for Structural Redundancy in Power Semiconductors [J].
Behjati, H. ;
Davoudi, Ali .
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 2013, 60 (10) :4376-4386
[7]   SiC versus Si-Evaluation of Potentials for Performance Improvement of Inverter and DC-DC Converter Systems by SiC Power Semiconductors [J].
Biela, Juergen ;
Schweizer, Mario ;
Waffler, Stefan ;
Kolar, Johann W. .
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 2011, 58 (07) :2872-2882
[8]   Physical modeling of fast p-i-n diodes with carrier lifetime zoning, part I: Device model [J].
Bryant, Angus T. ;
Lu, Liqing ;
Santi, Enrico ;
Palmer, Patrick R. ;
Hudgins, Jerry L. .
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2008, 23 (01) :189-197
[9]   Two-step parameter extraction procedure with formal optimization for physics-based circuit simulator IGBT and PIN diode models [J].
Bryant, AT ;
Kang, XS ;
Santi, E ;
Palmer, PR ;
Hudgins, JL .
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2006, 21 (02) :295-309
[10]   Physics-based PiN diode SPICE model for power-circuit simulation [J].
Buiatti, Gustavo Malagoni ;
Cappelluti, Federica ;
Ghione, Giovanni .
IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 2007, 43 (04) :911-919