Low-Reverse Recovery Charge Superjunction MOSFET With a p-Type Schottky Body Diode

被引:35
作者
Lin, Zhi [1 ,2 ]
Hu, Shengdong [1 ,2 ]
Yuan, Qi [1 ,2 ]
Zhou, Xichuan [1 ,2 ]
Tang, Fang [1 ,2 ]
机构
[1] Chongqing Univ, Minist Educ, Key Lab Dependable Serv Comp Cyber Phys Soc, Chongqing 400044, Peoples R China
[2] Chongqing Univ, Coll Commun Engn, Chongqing Engn Lab High Performance Integrated Ci, Chongqing 400044, Peoples R China
基金
中国国家自然科学基金;
关键词
Superjunction; power MOSFET; bodydiode; p-type Schottky contact; reverse recovery;
D O I
10.1109/LED.2017.2713519
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A novel low-reverse recovery charge superjunction MOSFET (SJ-MOSFET) with a p-type Schottky body diode is proposed in this letter. The device has a p-type Schottky contact on the p-pillar at the drain side. Electrons are prevented from injecting into the drain side by the p-type Schottky contact, and the total carrier concentration is greatly reduced. Compared with the conventional device, the proposed SJ-MOSFET has a lower reverse recovery charge and a larger soft factor. Simulated results show that the reverse recovery charge is reduced by 81.3% and 76.0% at 300 K and 400 K, respectively, with a metal work function of 4.5 eV. The optimized metal work function range is 4.3-4.6 eV.
引用
收藏
页码:1059 / 1062
页数:4
相关论文
共 11 条
  • [1] Analytical Switching Loss Model for Superjunction MOSFET With Capacitive Nonlinearities and Displacement Currents for DC-DC Power Converters
    Castro, Ignacio
    Roig, Jaume
    Gelagaev, Ratmir
    Vlachakis, Basil
    Bauwens, Filip
    Lamar, Diego G.
    Driesen, Johan
    [J]. IEEE TRANSACTIONS ON POWER ELECTRONICS, 2016, 31 (03) : 2485 - 2495
  • [2] Cheng X, 2003, ISPSD'03: 2003 IEEE 15TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS PROCEEDINGS, P304
  • [3] A new generation of high voltage MOSFETs breaks the limit line of silicon
    Deboy, G
    März, M
    Stengl, JP
    Strack, H
    Tihanyi, J
    Weber, H
    [J]. INTERNATIONAL ELECTRON DEVICES MEETING 1998 - TECHNICAL DIGEST, 1998, : 683 - 685
  • [4] An Improved Superjunction Structure With Variation Vertical Doping Profile
    Lin, Zhi
    Huang, Haimeng
    Chen, Xingbi
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2015, 62 (01) : 228 - 231
  • [5] Matsui R, 2015, IEEE C ELEC DEVICES, P375, DOI 10.1109/EDSSC.2015.7285129
  • [6] A 650 V Super-Junction MOSFET With Novel Hexagonal Structure for Superior Static Performance and High BV Resilience to Charge Imbalance: A TCAD Simulation Study
    Park, Jaehoon
    Lee, Jong-Ho
    [J]. IEEE ELECTRON DEVICE LETTERS, 2017, 38 (01) : 111 - 114
  • [7] Saito W, 2014, PROC INT SYMP POWER, P87, DOI 10.1109/ISPSD.2014.6855982
  • [8] Schmitt M, 2002, PROCEEDINGS OF THE 14TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES & ICS, P229
  • [9] A high Schottky-barrier of 1.1 eV between Al and S-passivated p-type Si(100) surface
    Song, G.
    Ali, M. Y.
    Tao, M.
    [J]. IEEE ELECTRON DEVICE LETTERS, 2007, 28 (01) : 71 - 73
  • [10] Superjunction Power Devices, History, Development, and Future Prospects
    Udrea, Florin
    Deboy, Gerald
    Fujihira, Tatsuhiko
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2017, 64 (03) : 713 - 727