A new bonding technique for human skin humidity sensors

被引:5
作者
Hanreich, G [1 ]
Nicolics, J [1 ]
Mündlein, M [1 ]
Hauser, H [1 ]
Chabicovsky, R [1 ]
机构
[1] Vienna Univ Technol, Inst Ind Elect & Mat Sci, A-1040 Vienna, Austria
关键词
bonding technique; laser micromachining; laser soldering; human skin humidity sensor;
D O I
10.1016/S0924-4247(01)00573-8
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
For human skin humidity sensors, absolute flat sensor surfaces are needed to bring the sensor into intimate contact with,the skin surface. To fulfill this requirement, a new bonding technique is presented which allows to perform contact pads not towering above the active sensor surface. As a new approach, the developed method is based on drilling of funnel-shaped holes in a Al2O3 ceramic substrate using a CO2 laser. After coating the bonding area with a solderable metallization (NiCr/Au), the funnel mouth serves as a reservoir for the lead-free, solder paste. The contact wires are guided through the holes perpendicular to the substrate surface. Subsequently, the CO2 laser is used for soldering the lead-in wires, and finally also for shaping and separating the respective single sensor units from the ceramic substrate. Combining all these production steps in a flexible numerically controlled laser micromachining process is an advantage particularly for small-lot fabrication and the rapid production of low-cost prototypes. (C) 2001 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:364 / 369
页数:6
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