Spurious heat conduction behavior of finite-size graphene nanoribbon under extreme uniaxial strain caused by the AIREBO potential
被引:18
作者:
Yang, Xueming
论文数: 0引用数: 0
h-index: 0
机构:
North China Elect Power Univ, Dept Power Engn, Baoding 071003, Peoples R China
Tsinghua Univ, Minist Educ, Dept Engn Mech, Key Lab Thermal Sci & Power Engn, Beijing 100084, Peoples R ChinaNorth China Elect Power Univ, Dept Power Engn, Baoding 071003, Peoples R China
Yang, Xueming
[1
,2
]
Wu, Sihan
论文数: 0引用数: 0
h-index: 0
机构:
North China Elect Power Univ, Dept Power Engn, Baoding 071003, Peoples R ChinaNorth China Elect Power Univ, Dept Power Engn, Baoding 071003, Peoples R China
Wu, Sihan
[1
]
Xu, Jiangxin
论文数: 0引用数: 0
h-index: 0
机构:
North China Elect Power Univ, Dept Power Engn, Baoding 071003, Peoples R ChinaNorth China Elect Power Univ, Dept Power Engn, Baoding 071003, Peoples R China
Xu, Jiangxin
[1
]
Cao, Bingyang
论文数: 0引用数: 0
h-index: 0
机构:
Tsinghua Univ, Minist Educ, Dept Engn Mech, Key Lab Thermal Sci & Power Engn, Beijing 100084, Peoples R ChinaNorth China Elect Power Univ, Dept Power Engn, Baoding 071003, Peoples R China
Cao, Bingyang
[2
]
To, Albert C.
论文数: 0引用数: 0
h-index: 0
机构:
Univ Pittsburgh, Dept Mech Engn & Mat Sci, Pittsburgh, PA 15260 USANorth China Elect Power Univ, Dept Power Engn, Baoding 071003, Peoples R China
To, Albert C.
[3
]
机构:
[1] North China Elect Power Univ, Dept Power Engn, Baoding 071003, Peoples R China
[2] Tsinghua Univ, Minist Educ, Dept Engn Mech, Key Lab Thermal Sci & Power Engn, Beijing 100084, Peoples R China
[3] Univ Pittsburgh, Dept Mech Engn & Mat Sci, Pittsburgh, PA 15260 USA
Although the AIREBO potential can well describe the mechanical and thermal transport of the carbon nanostructures under normal conditions, previous studies have shown that it may overestimate the simulated mechanical properties of carbon nanostructures in extreme strains near fracture. It is still unknown whether such overestimation would also appear in the thermal transport of nanostructrues. In this paper, the mechanical and thermal transport of graphene nanoribbon under extreme deformation conditions are studied by MD simulations using both the original and modified AIREBO potential. Results show that the cutoff function of the original AIREBO potential produces an overestimation on thermal conductivity in extreme strains near fracture stage. Spurious heat conduction behavior appears, e.g., the thermal conductivity of GNRs does not monotonically decrease with increasing strain, and even shows a "V" shaped reversed and nonphysical trend. Phonon spectrum analysis show that it also results in an artificial blue shift of G peak and phonon stiffening of the optical phonon modes. The correlation between spurious heat conduction behavior and overestimation of mechanical properties near the fracture stage caused by the original AIREBO potential are explored and revealed. (C) 2017 Elsevier B.V. All rights reserved.
引用
收藏
页码:46 / 53
页数:8
相关论文
共 51 条
[1]
Belytschko T, 2002, PHYS REV B, V65, DOI 10.1103/PhysRevB.65.235430
机构:
ASTAR, Inst High Performance Comp, Singapore 138632, Singapore
Natl Univ Singapore, Dept Mat Sci & Engn, Singapore 119077, SingaporeASTAR, Inst High Performance Comp, Singapore 138632, Singapore
Chen, M. Q.
Quek, S. S.
论文数: 0引用数: 0
h-index: 0
机构:
ASTAR, Inst High Performance Comp, Singapore 138632, SingaporeASTAR, Inst High Performance Comp, Singapore 138632, Singapore
Quek, S. S.
Sha, Z. D.
论文数: 0引用数: 0
h-index: 0
机构:
Xi An Jiao Tong Univ, State Key Lab Strength & Vibrat Mech Struct, Int Ctr Appl Mech, Xian 710049, Peoples R ChinaASTAR, Inst High Performance Comp, Singapore 138632, Singapore
Sha, Z. D.
Chiu, C. H.
论文数: 0引用数: 0
h-index: 0
机构:
Natl Univ Singapore, Dept Mat Sci & Engn, Singapore 119077, SingaporeASTAR, Inst High Performance Comp, Singapore 138632, Singapore
Chiu, C. H.
Pei, Q. X.
论文数: 0引用数: 0
h-index: 0
机构:
ASTAR, Inst High Performance Comp, Singapore 138632, SingaporeASTAR, Inst High Performance Comp, Singapore 138632, Singapore
Pei, Q. X.
Zhang, Y. W.
论文数: 0引用数: 0
h-index: 0
机构:
ASTAR, Inst High Performance Comp, Singapore 138632, SingaporeASTAR, Inst High Performance Comp, Singapore 138632, Singapore
机构:
SUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USASUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USA
Chu, Yanbiao
Ragab, Tarek
论文数: 0引用数: 0
h-index: 0
机构:
SUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USA
Univ Tabuk, Nanotechnol Res Lab, Tabuk, Saudi Arabia
Univ Alexandria, Alexandria, EgyptSUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USA
Ragab, Tarek
Basaran, Cemal
论文数: 0引用数: 0
h-index: 0
机构:
SUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USASUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USA
机构:
SUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USASUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USA
Chu, Yanbiao
Ragab, Tarek
论文数: 0引用数: 0
h-index: 0
机构:
SUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USA
Univ Tabuk, Nanotechnol Res Lab, Tabuk, Saudi Arabia
Alexanderia Univ, Alexandria, EgyptSUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USA
Ragab, Tarek
Basaran, Cemal
论文数: 0引用数: 0
h-index: 0
机构:
SUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USASUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USA
机构:
ASTAR, Inst High Performance Comp, Singapore 138632, Singapore
Natl Univ Singapore, Dept Mat Sci & Engn, Singapore 119077, SingaporeASTAR, Inst High Performance Comp, Singapore 138632, Singapore
Chen, M. Q.
Quek, S. S.
论文数: 0引用数: 0
h-index: 0
机构:
ASTAR, Inst High Performance Comp, Singapore 138632, SingaporeASTAR, Inst High Performance Comp, Singapore 138632, Singapore
Quek, S. S.
Sha, Z. D.
论文数: 0引用数: 0
h-index: 0
机构:
Xi An Jiao Tong Univ, State Key Lab Strength & Vibrat Mech Struct, Int Ctr Appl Mech, Xian 710049, Peoples R ChinaASTAR, Inst High Performance Comp, Singapore 138632, Singapore
Sha, Z. D.
Chiu, C. H.
论文数: 0引用数: 0
h-index: 0
机构:
Natl Univ Singapore, Dept Mat Sci & Engn, Singapore 119077, SingaporeASTAR, Inst High Performance Comp, Singapore 138632, Singapore
Chiu, C. H.
Pei, Q. X.
论文数: 0引用数: 0
h-index: 0
机构:
ASTAR, Inst High Performance Comp, Singapore 138632, SingaporeASTAR, Inst High Performance Comp, Singapore 138632, Singapore
Pei, Q. X.
Zhang, Y. W.
论文数: 0引用数: 0
h-index: 0
机构:
ASTAR, Inst High Performance Comp, Singapore 138632, SingaporeASTAR, Inst High Performance Comp, Singapore 138632, Singapore
机构:
SUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USASUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USA
Chu, Yanbiao
Ragab, Tarek
论文数: 0引用数: 0
h-index: 0
机构:
SUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USA
Univ Tabuk, Nanotechnol Res Lab, Tabuk, Saudi Arabia
Univ Alexandria, Alexandria, EgyptSUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USA
Ragab, Tarek
Basaran, Cemal
论文数: 0引用数: 0
h-index: 0
机构:
SUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USASUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USA
机构:
SUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USASUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USA
Chu, Yanbiao
Ragab, Tarek
论文数: 0引用数: 0
h-index: 0
机构:
SUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USA
Univ Tabuk, Nanotechnol Res Lab, Tabuk, Saudi Arabia
Alexanderia Univ, Alexandria, EgyptSUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USA
Ragab, Tarek
Basaran, Cemal
论文数: 0引用数: 0
h-index: 0
机构:
SUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USASUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USA