Low-power design and temperature management

被引：1

作者：

Skadron, Kevin ^{[1
]}

Bose, Pradip ^{[2
]}

Ghose, Kanad ^{[3
]}

Sendag, Resit ^{[4
]}

Yi, Joshua J.

Chiou, Derek ^{[5
]}

机构：

[1] Univ Virginia, Dept Comp Sci, Sch Engn & Appl Sci, Charlottesville, VA 22904 USA

[2] IBM TJ Watson Res Ctr, Armonk, NY USA

[3] SUNY Binghamton, Binghamton, NY USA

[4] Univ Rhode Isl, Kingston, RI 02881 USA

[5] Univ Texas Austin, Austin, TX 78712 USA

来源：

IEEE MICRO | 2007年 / 27卷 / 06期

关键词：

D O I：

10.1109/MM.2007.104

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

One of the primary concerns fob microprocessor designers has always been balancing power and thermal management while minimizing performance loss. rather than generate solutions to this dilemma, the advent of multicore chips has raised a host of new challenges. this discussion with Pradip Bose and Kanad Ghose, excerpted from a 2007 card workshop panel, explores the future of low-power design and temperature management.

引用

页码：46 / 57

页数：12