Effects of Ni-W(Au) coated Cu microcones on the bonding interfaces

被引：10

作者：

Hu, Fengtian ^{[1
]}

Wang, Haozhe ^{[1
]}

Yang, Shan ^{[1
]}

Hu, Anmin ^{[1
]}

Li, Ming ^{[1
]}

机构：

[1] Shanghai Jiao Tong Univ, Key Lab Thin Film & Microfabricat Technol, State Key Lab Met Matrix Composites, Sch Mat Sci & Engn,Minist Educ, Shanghai 200240, Peoples R China

来源：

APPLIED SURFACE SCIENCE | 2015年 / 353卷

基金：

中国国家自然科学基金;

关键词：

Ni-W alloys coating; Cu microcones; Interfacial reaction; Diffusion barrier layer; High temperature anticorrosion; NI-W ALLOYS; SN; RESISTANCE; MORPHOLOGY;

D O I：

10.1016/j.apsusc.2015.06.195

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Nickel-based alloys are being studied a lot currently in an effort to develop stable barrier films between solder and copper substrate. In this paper, electroplated Ni-21.4%W(Au) coating on the surfaces of copper microcones applying in low temperature solid state bonding has been investigated. X-ray diffraction (XRD) and scanning electron microscopy (SEM) result show that there is no significant change of the surface morphology Cu microcones after plating Ni-W(Au) film. SEM analysis revealed that the Ni-W alloys coating can effectively reduce the interfacial reaction and improve high-temperature anticorrosion prominently in the bonding process. A thin film of Au on the top of Ni-W layer effectively reduces the oxide layer growth. The strength of bonding joint is measured and the result reveals that this method can be used in the industry. (C) 2015 Elsevier B.V. All rights reserved.

引用

页码：774 / 780

页数：7

共 23 条

[1] Interfacial reaction of Pb-Sn solder and Sn-Ag solder with electroless Ni deposit during reflow [J].