GaN Power Integration for High Frequency and High Efficiency Power Applications: A Review

被引:151
作者
Sun, Ruize [1 ]
Lai, Jingxue [1 ]
Chen, Wanjun [1 ]
Zhang, Bo [1 ]
机构
[1] Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Peoples R China
关键词
GaN; HEMT; high frequency; power conversion; power integration; HIGH BREAKDOWN VOLTAGE; ALGAN/GAN HEMTS; BOOST CONVERTER; TEMPERATURE; MODE; TECHNOLOGY; RECTIFIER; CIRCUITS; DEVICES; DIODE;
D O I
10.1109/ACCESS.2020.2967027
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
High frequency and high efficiency operation is one of the premier interests in the signal and energy conversion applications. The wide bandgap GaN based devices possess superior properties and have demonstrated exceeding performance than Si or GaAs devices. In order to further exploit the potential of GaN electronics, monolithic power integration is proposed. Firstly, this paper discusses the structure and properties of GaN power devices to explain the choice of lateral integration in the view of GaN power ICs. Then the state-of-the-art performance of GaN power integration in two major application areas is reviewed, which are the microwave power amplification and DC-DC power conversion. The GaN power integration technologies in MMIC platforms are summarized in terms of the gate length, operation frequency and power added efficiency of ICs. On the other hand, the smart GaN power IC platforms have boosted the development of DC-DC power converters. Demonstrations of high frequency (1 MHz) and high efficiency (95 ) converters with various kinds of integration technology and topology are reviewed. Lastly novel integration schemes and methods are introduced to stimulate new thoughts on GaN power integration road.
引用
收藏
页码:15529 / 15542
页数:14
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