Evaluation of gluing of CFRP onto concrete structures by infrared thermography coupled with thermal impedance

被引:13
作者
Alexis, Chauchois [1 ,2 ]
Franck, Brachelet [1 ]
Didier, Defer [1 ]
Emmanuel, Antczak [1 ]
Hangseok, Choi [2 ]
机构
[1] Univ Artois, Univ Lille Nord France F59000, FSA, LGCgE, F-62400 Bethune, France
[2] Korea Univ, Sch Civil Environm & Architectural Engn, Seoul, South Korea
基金
新加坡国家研究基金会;
关键词
Debonding; Defects; Non-destructive testing; Thermal analysis; FRP; COMPOSITE; DAMAGE; BEAMS; BOND;
D O I
10.1016/j.compositesb.2014.10.002
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Carbon Fiber Reinforced Polymers (CFRPs) have been increasingly employed for structural strengthening, and are attached to structures using bonding adhesives. The aim of this work is to characterize defects in the bond between CFRP and concrete (after they are located by pulse infrared thermography), and assign the defects a "numerical value" (ranging from 0 for a complete air-gap to 1 for a fully glued bond). Quantitative characterization is performed by measuring the thermal impedance, and then identifying the thermophysical parameters of the system through fitting the measured impedance to a theoretical model. An inversion procedure is carried out to estimate the unknown parameters, without prior knowledge of sample properties. In particular, it is possible to estimate more accurately both the amount of glue within a defect and the thermal contact resistance. (C) 2014 Elsevier Ltd. All rights reserved.
引用
收藏
页码:350 / 358
页数:9
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