A new methodology for simultaneous switching noise simulation

被引：2
|
作者：
Zhao, J [1 ]
Chen, QL [1 ]
机构：
[1] Sigrity Inc, San Jose, CA 95125 USA
来源：
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2000年
关键词：
D O I：
10.1109/EPEP.2000.895517
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A new methodology for simultaneous switching noise simulation has been studied in this paper. By using SI software, SPEED97/2000, the simultaneous switching noise issue has been studied for a chipset package with 16 drivers switching simultaneously. The simulation results are then compared with HSPICE simulation by using a simple package equivalent circuit model, which is also extracted by SPEED97/2000.
引用
收藏
页码：155 / 158
页数：4
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