Thermal expansion behavior of copper matrix composite containing negative thermal expansion PbTiO3 particles

被引：31

作者：

Sheng, J. ^{[1
]}

Wang, L. D. ^{[1
]}

Li, D. ^{[1
]}

Cao, W. P. ^{[1
]}

Feng, Y. ^{[1
]}

Wang, M. ^{[1
]}

Yang, Z. Y. ^{[1
]}

Zhao, Y. ^{[2
]}

Fei, W. D. ^{[1
,3
]}

机构：

[1] Harbin Inst Technol, Sch Mat Sci & Engn, Harbin 150001, Peoples R China

[2] Harbin Inst Technol, Lab Space Environm & Phys Sci, Res Ctr Basic Space Sci, Harbin 150001, Peoples R China

[3] Harbin Inst Technol, State Kay Lab Adv Welding & Joining, Harbin 150001, Peoples R China

来源：

MATERIALS & DESIGN | 2017年 / 132卷

基金：

中国国家自然科学基金;

关键词：

PbTiO3; ceramic; Ferroelectrics; Copper matrix composite; Thermal expansion; MICROSTRUCTURE; CONDUCTIVITY;

D O I：

10.1016/j.matdes.2017.06.061

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

PbTiO3 ceramic exhibits large negative coefficient of thermal expansion in a wide temperature range. Here, we demonstrate that PbTiO3 particles is an effective filler to adjust the thermal expansion of coppermatrix composite. The PbTiO3/Cu composites in the present study are prepared by spark plasma sinteringmethod. The addition of PbTiO3 particles effectively reduces the coefficient of thermal expansion of the composite. The negative and decreasing thermal expansion of PbTiO3 particles suppresses the thermal expansion of Cu matrix with temperature increasing, which leads to low and stable coefficient of thermal expansion of the composite. (C) 2017 Elsevier Ltd. All rights reserved.

引用

页码：442 / 447

页数：6

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