Stability enhancement in InGaZnO thin-film transistor with a novel Al2O3/HfO2/Al2O3 as gate insulator

被引:1
作者
Ding, Xingwei [1 ,2 ]
Qin, Cunping [1 ,2 ]
Xu, Tao [1 ]
Song, Jiantao [1 ]
Zhang, Jianhua [1 ,2 ]
Jiang, Xueyin [3 ]
Zhang, Zhilin [1 ,3 ]
机构
[1] Shanghai Univ, Key Lab Adv Display & Syst Applicat, Minist Educ, 149 Yanchang Rd, Shanghai 200070, Peoples R China
[2] Shanghai Univ, Sch Mechatron & Automat, Shanghai, Peoples R China
[3] Shanghai Univ, Dept Mat Sci, Shanghai, Peoples R China
关键词
a-IGZO; Al2O3/HfO2/Al2O3; density-of-states; thin film transistors; ELECTRICAL-PROPERTIES; OXIDE; LAYER; THICKNESS; PERFORMANCE; DIELECTRICS;
D O I
10.1080/15421406.2017.1338408
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
This work reports an efficient route for enhancing the stability of amorphous InGaZnO (a-IGZO) thin film transistors (TFTs). It is clearly observed that the off-current in IGZO-TFT decreases by using a novel Al2O3/HfO2/Al2O3 gate insulator. Temperature-stress measurement were carried out to investigate the stability and the parameters related to activation energy (E-A) and density-of-states (DOS). The improved electrical properties are attributed to the suppression of leakage current and a lower trapping density at the channel-insulator interface. The results showed that temperature stability and electrical properties enhancements in a-IGZO thin film transistors can probably be ascribed to the smaller DOS.
引用
收藏
页码:235 / 242
页数:8
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