Thermal Analysis of Ball Grid Array Non-Volatile Memory Express Solid-State Drive in Vacuum

被引：2

作者：

Lee, Eung Chang ^{[1
,2
]}

Rho, Jinsung ^{[1
,3
]}

Kang, Heeyoub ^{[2
]}

Lee, Bong Jae ^{[1
]}

机构：

[1] Korea Adv Inst Sci & Technol, Dept Mech Engn, Daejeon 34141, South Korea

[2] Samsung Elect, Memory Div, Hwasung 18448, South Korea

[3] Samsung Elect, Mechatron Ctr, Hwasung 18448, South Korea

来源：

IEEE ELECTRON DEVICE LETTERS | 2018年 / 39卷 / 12期

关键词：

Ball grid array (BGA); solid state drive (SSD); non-volatile memory express (NVMe); thermal analysis; vacuum; NAND FLASH MEMORY; CO-DESIGN;

D O I：

10.1109/LED.2018.2877613

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Solid-state drives (SSDs) have been widely used in data storage for micro satellites, data centers, and mobile products due to their high performance and high reliability. Recently, Samsung Electronics starts to introduce a ball grid array (BGA) non-volatile memory express (NVMe) SSD, which is a combined package of controller and memory units (i.e., DRAM and NAND) into one package. Due to the smaller form factor with high storage densities and multi-functional devices of BGA NVMe SSDs, a thermal issue becomes more important, requiring fundamental understanding of heat dissipation mechanism. Moreover, for applications in micro satellites, thermal analysis of SSDs should be conducted in vacuum environment. Here, we investigate the heat dissipation mechanism in the newly developed BGA NVMe SSD in both the atmosphere and high-vacuum conditions. A finite-element-method-based numerical model is developed for the heat transfer analysis and is verified by experiments at various workload conditions.

引用

页码：1908 / 1911

页数：4