Thermal experimental and modeling analysis of high power 3D packages

被引：0

作者：

Oprins, H. ^{[1
]}

Cherman, V. ^{[1
]}

Van der Plas, G. ^{[1
]}

Maggioni, F. ^{[1
,2
]}

De Vos, J. ^{[1
]}

Beyne, E. ^{[1
]}

机构：

[1] IMEC, Leuven, Belgium

[2] Katholieke Univ Leuven, Dept Mech Engn, Leuven, Belgium

来源：

2015 INTERNATIONAL CONFERENCE ON IC DESIGN & TECHNOLOGY (ICICDT) | 2015年

关键词：

3DIC; thermal analysis; thermal measurements; high power;

D O I：

暂无

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

In this paper, we present the experimental and modeling characterization of 3D packages for high power applications using a dedicated stackable test chip. An advanced CMOS test chip with programmable power distribution and a 32x32 array of temperature sensors has been designed, fabricated, stacked and packaged in bare die 3D packages. The package thermal measurements have been used to characterize the thermal behavior and to successfully validate the thermal finite element modeling results.

引用

页数：4

共 9 条

[1]

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[2]

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[3]

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[4]

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[5]

OPRINS H, 2012, IEEE 62 EL COMP TECH, P1081

[6]

Oprins H., 2015, ECTC 2015 IEEE 65 EL

[7]

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[8]

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[9]

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