A novel Model for the Mechanism of Laser-Induced Back Side Wet Etching in Aqueous Cu Solutions using ns Pulses at 1064 nm

被引：13

作者：

Schwaller, P. ^{[1
]}

Zehnder, S. ^{[1
]}

von Arx, U. ^{[2
]}

Neuenschwander, B. ^{[1
]}

机构：

[1] Bern Univ Appl Sci, Photon & Surface Technol, Appl Laser, Pestalozzistr 20, CH-3400 Burgdorf, Switzerland

[2] Bern Univ Appl Sci, CH-2500 Biel, Switzerland

来源：

LASERS IN MANUFACTURING 2011: PROCEEDINGS OF THE SIXTH INTERNATIONAL WLT CONFERENCE ON LASERS IN MANUFACTURING, VOL 12, PT B | 2011年 / 12卷

关键词：

laser induced backside wet etching (LIBWE); laser ablation; surface micro-structuring; FUSED-SILICA;

D O I：

10.1016/j.phpro.2011.03.121

中图分类号：

O43 [光学];

学科分类号：

070207 ; 0803 ;

摘要：

Laser induced back side wet etching has shown to be a promising tool for the micro-structuring of transparent materials. Detailed studies have been performed using UV excimer laser sources, aromatic hydrocarbon and liquid metal absorbers. Only little work is reported however using aqueous Cu solutions as absorbers and ns laser pulses at 1064 nm wavelength. We present a novel model for this specific setup. Our experiments indicate that physisorbed Cu2+ ions at the polar glass surface absorb the laser light. This leads to local thermal stresses in the glass and subsequent micro-ablation.

引用

页码：188 / 194

页数：7

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