Laser-assisted selective copper deposition on commercial PA6 by catalytic electroless plating - Process and activation mechanism

被引：40

作者：

Ratautas, Karolis ^{[1
]}

Andrulevicius, Mindaugas ^{[2
]}

Jagminiene, Aldona ^{[1
]}

Stankeviciene, Ina ^{[1
]}

Norkus, Eugenijus ^{[1
]}

Raciukaitis, Gediminas ^{[1
]}

机构：

[1] Ctr Phys Sci & Technol, Savanoriu Ave 231, LT-02300 Vilnius, Lithuania

[2] Kaunas Univ Technol, Inst Mat Sci, Barsausko Str 59, LT-51423 Kaunas, Lithuania

来源：

APPLIED SURFACE SCIENCE | 2019年 / 470卷

关键词：

Selective electroless plating; Electric circuit; Polymer; Laser-assisted;

D O I：

10.1016/j.apsusc.2018.11.091

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Results of in-depth experimental analysis of the laser-assisted local copper deposition on commercial Polyamide 6 (PA 6) are presented. Pico- and nanosecond lasers were validated for surface modification of the polymer followed by silver (I) activation and finished by autocatalytic electroless copper plating on the laser-modified areas. Detailed investigations were dedicated to finding out the origin of selective metal plating, including the surface profiling and wettability dynamics, XPS analysis and electric resistance measurements of the deposited copper layer. Based on the experimental data, the mechanism of the polymer surface activation by the laser modification is proposed.

引用

页码：405 / 410

页数：6

共 25 条

[1] A fast and flexible method for manufacturing 3D molded interconnect devices by the use of a rapid prototyping technology
Amend, P.
Pscherer, C.
Rechtenwald, T.
Frick, T.
Schmidt, M.
[J]. LASER ASSISTED NET SHAPE ENGINEERING 6, PROCEEDINGS OF THE LANE 2010, PART 2, 2010, 5 : 561 - 572
[2] Bauerle D., 2013, Laser Processing and Chemistry
[3] High-speed multi-jets printing using laser forward transfer: time-resolved study of the ejection dynamics
Biver, Emeric
Rapp, Ludovic
Alloncle, Anne-Patricia
Serra, Pere
Delaporte, Philippe
[J]. OPTICS EXPRESS, 2014, 22 (14): : 17122 - 17134
[4] Laser-induced site-selective silver seeding on polyimide for electroless copper plating
Chen, Dongsheng
Lu, Qinghua
Zhao, Yan
[J]. APPLIED SURFACE SCIENCE, 2006, 253 (03) : 1573 - 1580
[5] ENERGY CALIBRATION SECONDARY STANDARDS FOR X-RAY PHOTOELECTRON SPECTROMETERS
EVANS, S
[J]. SURFACE AND INTERFACE ANALYSIS, 1985, 7 (06) : 299 - 302
[6] Effect of fillers on the metallization of laser-structured polymer parts
Fischer, Andreas J.
Meister, Steve
Drummer, Dietmar
[J]. JOURNAL OF POLYMER ENGINEERING, 2017, 37 (02) : 151 - 161
[7] Franke J., 2014, 3 DIMENSIONAL MOLDED, P173
[8] Huske M., 2001, P 3 LANE
[9] One-Step Fabrication of Copper Electrode by Laser-Induced Direct Local Reduction and Agglomeration of Copper Oxide Nanoparticle
Kang, Bongchul
Han, Seungyong
Kim, Jongsu
Ko, Seunghwan
Yang, Minyang
[J]. JOURNAL OF PHYSICAL CHEMISTRY C, 2011, 115 (48) : 23664 - 23670
[10] Laser based hybrid inkjet printing of nanoink for flexible electronics
Ko, SH
Chung, J
Choi, YH
Grigoropoulos, CP
Bieri, NR
Choi, TY
Dockendorf, C
Poulikakos, D
[J]. PHOTON PROCESSING IN MICROELECTRONICS AND PHOTONICS IV, 2005, 5713 : 97 - 104

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