Comparison between finite-element and analytical calculations for the lifetime estimation of bond wires in IGBT modules

被引：6

作者：

Hager, C ^{[1
]}

Stuck, A ^{[1
]}

Tronel, Y ^{[1
]}

Zehringer, R ^{[1
]}

Fichtner, W ^{[1
]}

机构：

[1] Swiss Fed Inst Technol, Integrated Syst Lab, Zurich, Switzerland

来源：

12TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES & ICS - PROCEEDINGS | 2000年

关键词：

D O I：

10.1109/ISPSD.2000.856828

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Coffin-Manson fatigue law based Lifetime estimations of aluminum bond wires in IGBT modules under field conditions were performed. The models were calibrated with fatigue data obtained from accelerated lifetime tests and plastic strain computations corresponding to test conditions. The calibrated laws were then used to predict the bond wire lifetime under field conditions. To evaluate the influence of the plastic strain calculations finite-element and analytical computations were performed and the resulting lifetimes compared.

引用

页码：291 / 294

页数：4

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