Influence of Channel Length Scaling on InGaZnO TFTs Characteristics: Unity Current-Gain Cutoff Frequency, Intrinsic Voltage-Gain, and On-Resistance

被引:31
作者
Bahubalindruni, Pydi Ganga [1 ,2 ,3 ]
Kiazadeh, Asal [2 ,3 ]
Sacchetti, Allegra [2 ,3 ]
Martins, Jorge [2 ,3 ]
Rovisco, Ana [2 ,3 ]
Tavares, Vitor Grade [4 ,5 ]
Martins, Rodrigo [2 ,3 ]
Fortunato, Elvira [2 ,3 ]
Barquinha, Pedro [2 ,3 ]
机构
[1] Indraprastha Inst Informat Technol, New Delhi 110020, India
[2] Univ Nova Lisboa, CENIMAT I3N, Fac Ciencias & Tecnol, Dept Ciencia Mat, P-2829516 Caparica, Portugal
[3] CEMOP UNINOVA, P-2829516 Caparica, Portugal
[4] Univ Porto, INESC TEC, P-4200465 Oporto, Portugal
[5] Univ Porto, Fac Engn, P-4200465 Oporto, Portugal
来源
JOURNAL OF DISPLAY TECHNOLOGY | 2016年 / 12卷 / 06期
关键词
Intrinsic voltage-gain; unity current-gain cutoff frequency; IGZO TFTs and channel length scaling; THIN-FILM TRANSISTORS; GIZO TFTS; PERFORMANCE;
D O I
10.1109/JDT.2016.2550610
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents a study concerning the role of channel length scaling on IGZO TFT technology benchmark parameters, which are fabricated at temperatures not exceeding 180 degrees C. The parameters under investigation are unity current-gain cutoff frequency, intrinsic voltage-gain, and on-resistance of the bottom-gate IGZOTFTs. As the channel length varies from 160 to 3 mu m, the measured cutoff frequency increases from 163 kHz to 111.5 MHz, which is a superior value compared to the other competing low-temperature thin-film technologies, such as organic TFTs. On the other hand, for the same transistor dimensions, the measured intrinsic voltage-gain is changing from 165 to 5.3 and the on-resistance is decreasing from 1135.6 to 26.1 k Omega. TFTs with smaller channel length (3 mu m) have shown a highly negative turn-on voltage and hump in the subthreshold region, which can be attributed to short channel effects. The results obtained here, together with their interpretation based on device physics, provide crucial information for accurate IC design, enabling an adequate selection of device dimensions to maximize the performance of different circuit building blocks assuring the multifunctionality demanded by system-on-panel concepts.
引用
收藏
页码:515 / 518
页数:4
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