Low temperature sintering of Ag nanoparticles for flexible electronics packaging

被引：275
作者：
Hu, A. [1 ]
Guo, J. Y. [2 ]
Alarifi, H. [1 ]
Patane, G. [3 ]
Zhou, Y. [1 ]
Compagnini, G. [3 ]
Xu, C. X. [2 ]
机构：
[1] Univ Waterloo, Dept Mech & Mechatron Engn, Ctr Adv Mat Joining, Waterloo, ON N2L 3G1, Canada
[2] Southeast Univ, State Key Lab Bioelect, Adv Photon Ctr, Nanjing 210096, Peoples R China
[3] Univ Catania, Dipartimento Sci Chim, I-95125 Catania, Italy
来源：
APPLIED PHYSICS LETTERS | 2010年 / 97卷 / 15期
基金：
加拿大自然科学与工程研究理事会;
关键词：
THERMAL-DECOMPOSITION; METALLOORGANIC NANOPARTICLES; SURFACE CHARACTERIZATION; CONDUCTIVE ADHESIVES; SILVER NANOPARTICLES; SPECTROSCOPY; TECHNOLOGY; NANOWIRES; BEHAVIOR; METALS;
D O I：
10.1063/1.3502604
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
We achieve robust bonding of Cu wires to Cu pads on polyimide with silver nanopaste cured at 373 K. The paste is prepared by simply condensing Ag nanoparticle (NP) solution via centrifuging. The bonding is formed by solid state sintering of Ag NPs through neck growth and direct metallic bonding between clean Ag-Cu interfaces. Both experiment and Monte Carlo simulation confirm that the melting point of joint clusters increases during sintering. This creates improved bonds for use at an elevated operating temperature using Ag NPs. (C) 2010 American Institute of Physics. [doi: 10.1063/1.3502604]
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页数：3
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