Doping characteristics of BF2+ implants in ⟨100⟩ and ⟨111⟩ silicon

被引:6
作者
Drobny, VF [1 ]
Rubalcava, J
机构
[1] Texas Instruments Inc, Tucson, AZ 85706 USA
[2] Maxim Integrated Prod, Beaverton, OR 97005 USA
关键词
annealing; boron compounds; fluorine diffusion processes; ion implantation; resistance; silicon;
D O I
10.1109/16.936586
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Significant differences were noticed between doping characteristics of BF2+ implanted (100) and (111) silicon. High lose BF2+ implants always produced higher sheet resistance (R-s) in (111) silicon, Compared to B+, the BF2+ implants exceeding the amorphization dose always resulted in higher R-s regardless of silicon orientation. Behavior was attributed to fluorine gettered at implant-induced defect sites, Sheet resistance of an F+ + B+ implanted layer was found to increase linearly with F+ dose. Residual fluorine content decreased with temperature, especially for (111) orientation, and coincided with a decrease in R-s. Effects of fluorine and crystal damage were separated experimentally and correlated to R-s of implanted layers. SIMS analysis revealed that fluorine segregated at two peaks in (111) silicon and four peaks in (100) silicon, Experimental results suggest that gettered fluorine and boron-fluorine bonds formed at heavily damaged crystal sites prevent boron from its full electrical activation in BF2+ implanted samples.
引用
收藏
页码:1661 / 1666
页数:6
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