Dual Grid Array Antennas in a Thin-Profile Package for Flip-Chip Interconnection to Highly Integrated 60-GHz Radios

被引：62

作者：

Zhang, Y. P. ^{[1
]}

Sun, M. ^{[2
]}

Liu, Duixian ^{[3
]}

Lu, Yilong ^{[1
]}

机构：

[1] Nanyang Technol Univ, Sch Elect & Elect Engn, Singapore 639798, Singapore

[2] Inst Infocomm Res, Singapore 138623, Singapore

[3] IBM Corp, TJ Watson Res Ctr, Yorktown Hts, NY 10598 USA

来源：

IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION | 2011年 / 59卷 / 04期

关键词：

Ball grid array package; grid array antenna; low temperature cofired ceramic (LTCC); 60-GHz radio; IN-PACKAGE; DESIGN; MMICS; WIRE;

D O I：

10.1109/TAP.2011.2109358

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We examine the current development of highly integrated 60-GHz radios with an interest in antenna-circuit interfaces. We design and analyze grid array antennas with special attention to the differential feeding and the patterned ground plane. More importantly, we integrate two grid array antennas in a package; propose the way of assembling it to the system printed circuit board; and demonstrate a total solution of low cost and thin profile to highly integrated 60-GHz radios. We show that the package in low temperature cofired ceramic (LTCC) technology measures only 13 x 13 x 0.575 mm(3); can carry a 60-GHz radio die of current and future sizes with flip-chip bonding; and achieves good antenna performance in the 60-GHz band with maximum gain of 13.5 and 14.5 dBi for the single-ended and differential antennas, respectively.

引用

页码：1191 / 1199

页数：9

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