Improved Inversion Channel Mobility in 4H-SiC MOSFETs on Si Face Utilizing Phosphorus-Doped Gate Oxide

被引:248
作者
Okamoto, Dai [1 ]
Yano, Hiroshi [1 ]
Hirata, Kenji [1 ]
Hatayama, Tomoaki [1 ]
Fuyuki, Takashi [1 ]
机构
[1] Nara Inst Sci & Technol, Nara 6300192, Japan
关键词
Interface state density; phosphorus-doped oxide; phosphoryl chloride (POCl3); silicon carbide (SiC) metal-oxide-semiconductor field-effect transistors (MOSFETs); INTERFACE; OXIDATION; DENSITY;
D O I
10.1109/LED.2010.2047239
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We propose a new technique for fabricating 4H-SiC metal-oxide-semiconductor field-effect transistors (MOSFETs) with high inversion channel mobility. P atoms were incorporated into the SiO2/4H-SiC (0001) interface by postoxidation annealing using phosphoryl chloride (POCl3). The interface state density near the conduction band edge of 4H-SiC was reduced significantly, and the peak field-effect mobility of lateral 4H-SiC MOSFETs on (0001) Si face was improved to 89 cm(2)/V . s by POCl3 annealing at 1000 degrees C.
引用
收藏
页码:710 / 712
页数:3
相关论文
共 14 条
[1]   Improved inversion channel mobility for 4H-SiC MOSFETs following high temperature anneals in nitric oxide [J].
Chung, GY ;
Tin, CC ;
Williams, JR ;
McDonald, K ;
Chanana, RK ;
Weller, RA ;
Pantelides, ST ;
Feldman, LC ;
Holland, OW ;
Das, MK ;
Palmour, JW .
IEEE ELECTRON DEVICE LETTERS, 2001, 22 (04) :176-178
[2]   High field-effect mobility in n-channel Si face 4H-SiC MOSFETs with gate oxide grown on aluminum ion-implanted material [J].
Gudjónsson, G ;
Olafsson, HÖ ;
Allerstam, F ;
Nilsson, PÅ ;
Sveinbjörnsson, EÖ ;
Zirath, H ;
Rödle, T ;
Jos, R .
IEEE ELECTRON DEVICE LETTERS, 2005, 26 (02) :96-98
[3]   Remarkable increase in the channel mobility of SiC-MOSFETs by controlling the interfacial SiO2 layer between Al2O3 and SiC [J].
Hatayama, Tomohiro ;
Hino, Shiro ;
Miura, Naruhisa ;
Oomori, Tatsuo ;
Tokumitsu, Eisuke .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2008, 55 (08) :2041-2045
[4]   Interfacial characteristics of N2O and NO nitrided SiO2 grown on SiC by rapid thermal processing [J].
Li, HF ;
Dimitrijev, S ;
Harrison, HB ;
Sweatman, D .
APPLIED PHYSICS LETTERS, 1997, 70 (15) :2028-2030
[5]   High-mobility enhancement-mode 4H-SiC lateral field-effect transistors utilizing atomic layer deposited Al2O3 gate dielectric [J].
Lichtenwalner, Daniel J. ;
Misra, Veena ;
Dhar, Sarit ;
Ryu, Sei-Hyung ;
Agarwal, Anant .
APPLIED PHYSICS LETTERS, 2009, 95 (15)
[6]  
NICOLLIAN EH, 1982, MOS METAL OXIDE SEMI, P331
[7]   Systematic Investigation of Interface Properties in 4H-SiC MOS Structures Prepared by Over-Oxidation of Ion-Implanted Substrates [J].
Okamoto, D. ;
Yano, H. ;
Hatayama, T. ;
Fuyuki, T. .
SILICON CARBIDE AND RELATED MATERIALS 2009, PTS 1 AND 2, 2010, 645-648 :495-498
[8]   Ab initio theoretical study of an oxygen vacancy defect at the 4H-SiC(0001)/SiO2 interface [J].
Okuno, Eiichi ;
Sakakibara, Toshio ;
Onda, Shoichi ;
Itoh, Makoto ;
Uda, Tsuyoshi .
PHYSICAL REVIEW B, 2009, 79 (11)
[9]   A field-effect electron mobility model for SiC MOSFETs including high density of traps at the interface [J].
Pérez-Tomás, A ;
Godignon, P ;
Mestres, N ;
Millán, J .
MICROELECTRONIC ENGINEERING, 2006, 83 (03) :440-445
[10]   The Limits of Post Oxidation Annealing in NO [J].
Rozen, John ;
Zhu, Xingguang ;
Ahyi, A. C. ;
Williams, J. R. ;
Feldman, L. C. .
SILICON CARBIDE AND RELATED MATERIALS 2009, PTS 1 AND 2, 2010, 645-648 :693-+