Experimental study of thermal stresses in a bonded joint

被引:2
作者
Deheeger, A. [1 ]
Badulescu, C. [1 ]
Mathias, J. D. [2 ]
Grediac, M. [1 ]
机构
[1] Univ Blaise Pascal Clermont II, Inst Francais Mecan Avancee, Lab Mecan & Ingn, Campus Cezeaux,BP 265, F-63175 Aubiere, France
[2] Irstea, Lab Ingn Syst Comp, F-63172 Aubiere, France
来源
7TH INTERNATIONAL CONFERENCE ON MODERN PRACTICE IN STRESS AND VIBRATION ANALYSIS | 2009年 / 181卷
关键词
D O I
10.1088/1742-6596/181/1/012041
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
This paper deals with the assessment of the thermal stress distribution in a composite/aluminium bonded joint. An aluminum specimen symmetrically reinforced with two composite patches is heated while both thermal and displacement fields are measured with an infrared camera and a CCD camera, respectively. The grid method is used to obtain the displacement fields in the composite patch. This displacement field is in good agreement with theoretical expectations. This enables us to deduce the longitudinal strain in the composite patch by fitting the displacement field with a suitable model and differentiating it. The shear stress peak which takes place in the adhesive near the free edge of the patch is finally estimated.
引用
收藏
页数:6
相关论文
共 6 条
[1]  
[Anonymous], 1973, ADHESIVE BONDED DOUB
[2]  
BADULESCU C, 2008, EXPT MECH IN PRESS
[3]  
DEHEEGER A, 2008, INT J ADHES IN PRESS
[4]  
PIRO JL, 2004, EXPT TECHNICS, V28
[5]  
Surrel Y, 1994, INTERFEROMETRY 94 PH, V2342
[6]  
Volkersen O., 1938, Laschenquerschritten, and Luftfahrtforschung, P41