Tensile deformation of electroplated copper nanopillars

被引:62
|
作者
Jennings, Andrew T. [1 ]
Greer, Julia R. [1 ]
机构
[1] CALTECH, Pasadena, CA 91125 USA
基金
美国国家科学基金会;
关键词
copper; nanoscale plasticity; electroplating; single crystal; nanopillar; uniaxial tension; dislocation; COHERENT TWIN BOUNDARIES; CENTERED-CUBIC METALS; SCALE SINGLE-CRYSTALS; MICRON-SCALE; MECHANICAL-PROPERTIES; UNIAXIAL COMPRESSION; ULTRAHIGH STRENGTH; PLASTICITY; NANOSCALE; PILLARS;
D O I
10.1080/14786435.2010.505180
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The results are presented of uniaxial tensile testing of single crystalline electroplated copper nanopillars with diameters between 75 nm and 165 nm fabricated without the use of a focused ion beam (FIB). The experiments were performed in an in situ nanomechanical instrument, SEMentor, and reveal that the pillars' ultimate tensile strengths follow a similar power law dependence on diameter as reported for microcompression studies on fcc metals fabricated with and without FIB. Further, these pillars are characterized by limited or non-existent initial homogeneous deformation, immediately followed by necking in the top portion of the pillar. The particular deformation attributes are discussed in the context of hardening by dislocation starvation. Site-specific transmission electron microscopy microstructural analysis of as-fabricated nanopillars indicates the presence of scarce twin boundaries in some specimens. We comment on the potential for mechanical effects due to the presence of twins.
引用
收藏
页码:1108 / 1120
页数:13
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