Size effect in material removal by cutting at nano scale

被引:46
作者
Fang, Fengzhou [1 ]
Xu, Feifei [1 ,2 ]
Lai, Min [1 ]
机构
[1] Tianjin Univ, Ctr MicroNano Mfg Technol, State Key Lab Precis Measuring Technol & Instrume, Tianjin 300072, Peoples R China
[2] China Acad Engn Phys, Inst Mech Mfg Technol, Mianyang 621900, Sichuan, Peoples R China
关键词
Nanocutting; Size effect; Specific cutting energy; Material removal; Cutting mechanism; EDGE RADIUS;
D O I
10.1007/s00170-015-7032-3
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
The size effect in cutting process that the specific cutting energy increases rapidly and nonlinearly as the undeformed chip thickness (UCT) decrease is discussed. To facilitate the discussion, the specific cutting energy is analyzed by separating the cutting mechanism into two parts: shearing and extrusion. The size effect of materials such as dislocation starvation was introduced to explain the increase of specific cutting energy. In conventional cutting, shearing dominates the size effect. And as the UCT reduces, the effect of tool radius is not ignorable, and extrusion participates more in describing the size effect. When the UCT is on the nanometric scale, extrusion dominates the cutting process. Besides that, the cutting energy was further separated into surface generation energy, material disorder energy, and heat generation energy. Each of them was discussed individually. The results show that the size effect of materials plays a major role in the change of specific cutting energy. And the other aspects like surface generation and material disorder also determine the size effect in cutting process.
引用
收藏
页码:591 / 598
页数:8
相关论文
共 28 条
  • [1] BEVER MB, 1972, PROG MATER SCI, V17, P5
  • [2] Modelling the cutting edge radius size effect for force prediction in micro milling
    Bissacco, G.
    Hansen, H. N.
    Slunsky, J.
    [J]. CIRP ANNALS-MANUFACTURING TECHNOLOGY, 2008, 57 (01) : 113 - 116
  • [3] Size effects on surface generation in micro milling of hardened tool steel
    Bissacco, G.
    Hansen, H. N.
    De Chiffre, L.
    [J]. CIRP ANNALS-MANUFACTURING TECHNOLOGY, 2006, 55 (01) : 593 - 596
  • [4] Nanohardness of high purity Cu (111) single crystals: The effect of indenter load and prior plastic sample strain
    Dub, S. N.
    Lim, Y. Y.
    Chaudhri, M. M.
    [J]. JOURNAL OF APPLIED PHYSICS, 2010, 107 (04)
  • [5] A study on mechanism of nano-cutting single crystal silicon
    Fang, F. Z.
    Wu, H.
    Zhou, W.
    Hu, X. T.
    [J]. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2007, 184 (1-3) : 407 - 410
  • [6] Diamond cutting of silicon with nanometric finish
    Fang, FZ
    Venkatesh, VC
    [J]. CIRP ANNALS 1998 - MANUFACTURING TECHNOLOGY, VOL 47, NO 1, 1998, 47 : 45 - 49
  • [7] The use of the size effect in grinding for work-hardening
    Heinzel, C.
    Bleil, N.
    Peters, J.
    [J]. CIRP ANNALS-MANUFACTURING TECHNOLOGY, 2007, 56 (01) : 327 - 330
  • [8] Izumi S., 2003, Journal of the Society of Materials Science, Japan, V52, P231, DOI 10.2472/jsms.52.231
  • [9] Determination of temperature rise during high strain rate deformation
    Kapoor, R
    Nemat-Nasser, S
    [J]. MECHANICS OF MATERIALS, 1998, 27 (01) : 1 - 12
  • [10] Insight into the deformation behavior of niobium single crystals under uniaxial compression and tension at the nanoscale
    Kim, Ju-Young
    Jang, Dongchan
    Greer, Julia R.
    [J]. SCRIPTA MATERIALIA, 2009, 61 (03) : 300 - 303