On-chip test infrastructure design for optimal multi-site testing of system chips

被引:9
作者
Goel, SK [1 ]
Marinissen, EJ [1 ]
机构
[1] IC Design, Digital Design & Test, NL-5656 AA Eindhoven, Netherlands
来源
DESIGN, AUTOMATION AND TEST IN EUROPE CONFERENCE AND EXHIBITION, VOLS 1 AND 2, PROCEEDINGS | 2005年
关键词
D O I
10.1109/DATE.2005.231
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
Multi-site testing is a popular and effective way to increase test throughput and reduce test costs. We present a test throughput model, in which we focus on wafer testing, and consider parameters like test time, index time, abort-on-fail, and contact yield Conventional multi-site testing requires sufficient ATE resources, such as ATE channels, to allow to test multiple SOCs in parallel. In this paper, we design and optimize on-chip DJT in order to maximize the test throughput for a given SOC and ATE. The oil-chip DfT consists of an E-RPCT wrapper and, for modular SOCs, module wrappers and TAMs. We present experimental results for a Philips SOC and several ITC'02 SOC Test Benchmarks.
引用
收藏
页码:44 / 49
页数:6
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