Thin films of FexNi1-x electroplated on silicon (100)

被引:27
作者
Spada, E. R.
de Oliveira, L. S.
da Rocha, A. S.
Pasa, A. A.
Zangari, G.
Sartorelli, M. L.
机构
[1] Univ Fed Santa Catarina, CFM, Dept Fis, BR-88040900 Florianopolis, SC, Brazil
[2] Univ Virginia, Mat Sci & Engn CESE, Charlottesville, VA 22904 USA
关键词
Fe-Ni; Electrodeposition; semiconductor substrate; AMR; stripe domains;
D O I
10.1016/j.jmmm.2003.12.218
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
FexNi1-x thin films were electroplated in the constant current mode directly onto n-type Si (100) using saccharin as a leveller agent. Fe content varied between 7 and 20 at%. Current efficiency increased with current density and also with film thickness, ranging from 35% to 76%. Films with a nominal thickness of 2800 nm showed a magnetoresistance of 3.6% and a coercive field of 3.5 Oe for deposits grown at 12.6 mA/cm(2). F or x <20; magnetization curves displayed a skewed shape, characteristic of a stripe domain configuration perpendicular to the plane of the film. (C) 2004 Elsevier B.V. All rights reserved.
引用
收藏
页码:E891 / E892
页数:2
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