High-frequency and high-temperature stable surface acoustic wave devices on ZnO/SiO2/SiC structure

被引:20
作者
Lu, Zengtian [1 ]
Fu, Sulei [2 ]
Chen, Zhenglin [3 ]
Shen, Junyao [2 ]
Su, Rongxuan [2 ]
Wang, Rui [2 ]
Song, Cheng [2 ]
Zeng, Fei [2 ]
Wang, Weibiao [4 ]
Pan, Feng [2 ]
机构
[1] Southeast Univ, Sch Mech Engn, Nanjing 211189, Peoples R China
[2] Tsinghua Univ, Key Lab Adv Mat MOE, Sch Mat Sci & Engn, Beijing 100084, Peoples R China
[3] Nanjing Univ, Sch Elect Sci & Engn, Nanjing 210093, Peoples R China
[4] SHOULDER Elect Ltd, Wuxi 214124, Jiangsu, Peoples R China
关键词
surface acoustic wave; high frequency; temperature compensation; SiC; THIN-FILM; SAW DEVICE; SIMULATION;
D O I
10.1088/1361-6463/ab8324
中图分类号
O59 [应用物理学];
学科分类号
摘要
The explosive growth of wireless communication and the creation of new frequency bands for 5G systems increasingly require surface acoustic wave (SAW) with high operating frequency (i.e. 3-6 GHz) as well as high-temperature stability. In this work, high-frequency and high-temperature stable SAW devices using ZnO/SiO2/SiC layered structures were proposed and reported. SAW characteristics of the Sezawa wave mode, including the phase velocities (V-p), electromechanical coupling coefficients (K-2) and temperature coefficient of frequency (TCF), were studied systematically by the finite element method. High-frequency SAW one-port resonators with the resonant frequency ranging from similar to 4.5-5.4 GHz were fabricated on the above structures. With SiC substrate providing high velocity and SiO2 interlayer for temperature compensation, a 5.0 GHz and nearly zero TCF of 0.7 ppm degrees C-1 can be achieved in a SAW device based on ZnO/SiO2/SiC structure. The good performance of these devices demonstrates that the ZnO/SiO2/SiC structure is promising for high-frequency and good temperature-stability SAW device applications.
引用
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页数:7
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