Effect of Heat Treatment on Microstructure and Properties of Sip/Al Composites

被引：0

作者：

Liu, Meng ^{[1
]}

Wan, Hong ^{[1
]}

Zhang, Hong ^{[1
]}

Bai, Shu-xin ^{[1
]}

机构：

[1] Natl Univ Def Technol, Coll Aerosp & Mat Engn, Changsha 410073, Hunan, Peoples R China

来源：

PROCEEDINGS OF THE 7TH NATIONAL CONFERENCE ON CHINESE FUNCTIONAL MATERIALS AND APPLICATIONS (2010), VOLS 1-3 | 2010年

关键词：

Sip/Al composites; heat treatment; configuration evolution; changes of the properties;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The evolution of silicon phase configuration and the changes in hermeticity, bend strength, thermal conductivity and coefficients of thermal expansion of Sip/Al composites during different kinds of heat treatment were investigated in this article. It is discovered that the configuration evolution during heat treatment is as follows: the corners and edges of the silicon particles are dissolved; the small silicon particles are dissolved and disappeared finally; the big silicon particles become bigger and reticular. It is also discovered that, after 420 degrees C x 1h heat treatment, the changes of the hermeticity of Sip/Al composites are not obvious; however, the bend strength, thermal conductivity and coefficients of thermal expansion decreased obviously; after 600 degrees C x 1h and 600 degrees C x 4h heat treatment, the lacunae in Sip/Al composites increased obviously, which greatly affect the properties of the composites.

引用

页码：678 / 683

页数：6

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