Residual Stress in Brazing of Submicron Al2O3 to WC-Co

This study evaluated the residual stresses induced by brazing and grinding submicron Al2O3, using different methods. Energy dispersive x-ray spectrometry analysis (EDX) of 72Ag-Cu filler and filler/WC-Co interface showed evidence of atomic diffusion and possible formation of titanium oxide layers between the joint and the bonding materials. An analytical model supported by the finite element method (FEM) based on strain determination due to the difference in variation of thermal expansion was used to assess the stress distribution at the coupling interface and in bulk materials. The model took into account the evolution of the Young's modulus and of the thermal expansion with temperature. The model could be used to follow strain and stress evolutions of the bonded materials during the cooling cycle. The maximum stress rose above -300 MPa at the center of the 100 x 100 x 3 mm ceramic plates. The residual stresses on the external surface of ceramic were investigated by x-ray diffraction (XRD) and indentation fracture method (IFM). After brazing and grinding the plate, the principal stresses were 128.1 and 94.9 MPa, and the shear stress was -20.1 MPa. Microscopic examination revealed grain pull-out promoted by the global residual stresses induced by the brazing and grinding processes. The surface stresses evaluated by the different methods were reasonably correlated.