Impact of abrasive particles on the material removal rate in CMP - A microcontact perspective

被引：38

作者：

Jeng, YR ^{[1
]}

Huang, PY ^{[1
]}

机构：

[1] Natl Chung Cheng Univ, Dept Mech Engn, Chiayi 621, Taiwan

来源：

ELECTROCHEMICAL AND SOLID STATE LETTERS | 2004年 / 7卷 / 02期

关键词：

D O I：

10.1149/1.1637561

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

The effects of particle size within the chemical mechanical polishing (CMP) process are investigated using a microcontact wear model which considers the particle effects between the polishing interface during load balancing. The present theoretical results are in good agreement with the experimental data published previously. The current study provides a detailed understanding of the effects of the abrasive particles from an interfacial perspective. (C) 2004 The Electrochemical Society.

引用

页码：G40 / G43

页数：4

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