Depth resolution enhancement by combined DSIMS and TOF-LEIS profiling

被引:5
作者
Babor, Petr [1 ]
Duda, Radek [1 ]
Prusa, Stanislav [1 ]
Matlocha, Tomas [1 ]
Kolibal, Miroslav [1 ]
Cechal, Jan [1 ]
Urbanek, Michal [1 ]
Sikola, Tomas [1 ]
机构
[1] Brno Univ Technol, Inst Engn Phys, Fac Mech Engn, Brno 61669, Czech Republic
关键词
DSIMS; TOF-LEIS; LEIS; Depth profiling; MoSi; HRTEM; ENERGY ION-SCATTERING; THIN-FILMS; BEAM ANALYSIS;
D O I
10.1016/j.nimb.2010.11.087
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
A combination of dynamic secondary ion mass spectroscopy (DSIMS) and time-of-flight low-energy ion scattering (TOF-LEIS) has been applied to acquire a composition depth profile of MoSi multilayers. During the sequential Ar+ sputtering secondary ions were monitored while in-between the sputtering cycles the TOF-LEIS spectra of scattered He neutrals were acquired. All the measured TOF-LEIS spectra versus sputtering time were displayed in one bitmap from which the depth profiles for different scattering depths were derived and analyzed. Analyzing the TOF-LEIS spectra of He particles scattered from the areas below the layer altered by ion-beam mixing led to an improvement of the depth resolution. In this way the resolution limits due to mixing phenomena can be overcome. Finally, the direct comparison of the DSIMS and TOF-LEIS depth profiles was carried out. (C) 2010 Elsevier B.V. All rights reserved.
引用
收藏
页码:369 / 373
页数:5
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