Tensile testing of silicon thin films

被引：24

作者：

Tsuchiya, T ^{[1
]}

机构：

[1] Toyota Cent Res & Dev Labs Inc, Nagakute, Aichi 4801192, Japan

来源：

FATIGUE & FRACTURE OF ENGINEERING MATERIALS & STRUCTURES | 2005年 / 28卷 / 08期

关键词：

electrostatic force grip; polysilicon; single-crystal silicon; tensile test; tensile strength;

D O I：

10.1111/j.1460-2695.2005.00910.x

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

The tensile strength of silicon thin films was investigated using a specimen chucking system dedicated for microscale specimens. The system uses electrostatic force to fix and hold the free end of the cantilever-shaped specimens. The thin film tensile tester was built using this system. The accuracy and reliability of this method were assured by comparing it with other tensile-testing methods using single-crystal silicon specimens. The result shows good agreement between the testing methods. The strength properties of polysilicon thin films, such as the effect of the testing environment and the specimen size and the film fabrication conditions, were investigated.

引用

页码：665 / 674

页数：10

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