SILVER ALLOY WIRE FOR IC PACKAGING SOLUTION

被引：0

作者：

Wei, Tan Boo ^{[1
]}

Hua, Niu You ^{[1
]}

Sheng, Wu Kang ^{[1
]}

机构：

[1] Carsem Semicond, R&D Dept, Suzhou 215021, Jiangsu, Peoples R China

来源：

2015 China Semiconductor Technology International Conference | 2015年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In recent years, copper wire has been widely proliferated into mass production. However, the hardness of copper wire requires higher ultrasonic power and bonding force, which lead to higher risk of bond pad crack, in order to avoid bond pad crack without re-engineering the bond pad, silver alloy wire is proposed as an alternative to cu wire bonding due to its softer material property. In this paper, the authors researched into process development of silver alloy wire, including fine tuning of material properties, wire bond and assembly process optimization, and reliability assessment.

引用

页数：3