An alternative surface finish for tin-lead solders

A novel tin electrodeposition chemistry and process has been developed, This process produces smooth, satin bright tin deposits that have stable, large grain structures. The deposits contain very low organic content and, as a consequence, exhibit excellent ductility, solderability and reflowability. The chemistry is capable of operating at elevated temperatures over a wide range of current densities, and is thus applicable to rack, barrel and reel-to-reel operations. All chemical components, including breakdown products, are fully analyzable with conventional analytical methods. Extensive bath life studies show that the deposit appearance and material properties, including grain structures, are stable in relation to the age of the electroplating chemistry, In addition, the grain refiners used are highly stable, and have few breakdown products as the chemistry ages, All these features imply a robust process that has been confirmed in various manufacturing environments, This tin electroplating process has been utilized in plating coatings for connectors, solder bumps, PWBs and components for semiconductor applications.