The Effect of Nanocopper Additions in a Urea-Formaldehyde Adhesive on the Physical and Mechanical Properties of Particleboard Manufactured from Date Palm Waste

The effect of addition of copper nanoparticles to a urea-formaldehyde (UF) adhesive on the physical and mechanical properties of particleboards manufactured from date palm waste (DPW) was investigated. The variable factors in the study included copper nanoparticles in amounts of 6 and 8 wt.% of the dry mass of wood, pressing durations of 5 and 6 min, and pressing temperatures of 150 and 160A degrees C. The physical and mechanical properties of manufactured boards were measured according to EN standards. The results showed that the addition of copper nanoparticles to the UF adhesive considerably improved the physical and mechanical properties of the boards and shortened the pressing duration. The boards manufactured with 6 wt.% copper nanoparticles in a dry mass of wood mixed with the adhesive and pressed at a temperature of 160A degrees C for 5 min had mechanical properties exceeding the EN312-2 standard levels.