Fluoride resonant tunneling diodes on Si substrates improved by additional thermal oxidation process

被引:19
作者
Watanabe, S [1 ]
Maeda, M [1 ]
Sugisaki, T [1 ]
Tsutsui, K [1 ]
机构
[1] Tokyo Inst Technol, Interdisciplinary Grad Sch Sci & Engn, Midori Ku, Yokohama, Kanagawa 2268502, Japan
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS | 2005年 / 44卷 / 4B期
关键词
resonant tunneling diode; RTD; fluoride; CaF2; CdF2; Si; oxidation process;
D O I
10.1143/JJAP.44.2637
中图分类号
O59 [应用物理学];
学科分类号
摘要
An oxidation process was applied to the fabrication of fluoride resonant tunneling diodes (RTDs) on Si substrates. The oxidation process was carried out after the growth of an ultrathin CaF2 layer on Si, and expected to passivate the Si surface in a pinholes generated in the CaF2 layer. Leakage currents of Au/Al/CaF2/Si(111) metal insulator semiconductor (MIS) diodes were extremely reduced by introducing this process. Au/Al/CaF2/CdF2/CaF2 /Si(111) double-barrier RTDs were also fabricated by introducing this process, the leakage currents of which were extremely reduced and a very large peak to valley current ratio (PVCR) of 1500 was obtained. It was also shown that the chemical reaction between a CdF2 well layer and the Si substrate was suppressed by the oxidation process. Owing to this effect, hi.-h-temperature growth (up to 300 degrees C) of the CdF2 well layer was realized for the first time in the fluoride RTDs, and resulted in the reduction of undesirable current drift.
引用
收藏
页码:2637 / 2641
页数:5
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