Effect of oxygen on Ag sintering technology with low temperature pressureless

被引：0

作者：

Chen, Chuantong ^{[1
]}

Choe, Chanyang ^{[1
]}

Zhang, Zheng ^{[1
]}

Nagao, Shijo ^{[1
]}

Suganuma, Katsuaki ^{[1
]}

机构：

[1] Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan

来源：

2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2018年

关键词：

Ag sintering technology; Hybrid Ag paste; atmosphere conditions; mechanical properties; SILVER; PASTE;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Ag sintering technology has received more and more attention to achieve the high-temperature applications above 250 degrees C due to its super physical properties in the wide band gap power device modules. However, the sintering mechanism of micron-size Ag particles during the sintering process was not clear especially at low temperature and pressureless. In this paper, the hybrid Ag paste was used to achieve low temperature pressureless sintering. The Ag paste was sintered in air and nitrogen atmosphere in order to investigate the effect of oxygen on sintering. Mechanical properties including tensile fracture strength and shear fracture strength were evaluated for sintered Ag specimens under the two kinds of sintering conditions by tensile test and shear test, respectively. These results show that both of tensile strength and shear strength of specimens sintered in air was far larger than that sintered in nitrogen. In addition, the mechanical properties of sintered Ag related to the microstructure are discussed based on SEM and TEM observation. These results revealed that O-2 play important roles in sintering, which promote Ag nanoparticles self-generation and thus strengthens connection among Ag particles.

引用

页码：15 / 18

页数：4

共 10 条

[1]

Chen C., 2016, J ELECT MAT, V46, P1576

[2] The supersonic molecular beam injector as a reliable tool for plasma fueling and physics experiment on HL-2A [J].

Chen, C. Y. ;

Yu, D. L. ;

Feng, B. B. ;

Yao, L. H. ;

Song, X. M. ;

Zang, L. G. ;

Gao, X. Y. ;

Yang, Q. W. ;

Duan, X. R. .

REVIEW OF SCIENTIFIC INSTRUMENTS, 2016, 87 (09)

[3] Bonding technology based on solid porous Ag for large area chips [J].

Chen, Chuantong ;

Noh, Seungjun ;

Zhang, Hao ;

Choe, Chanyang ;

Jiu, Jinting ;

Nagao, Shijo ;

Suganuma, Katsuaki .

SCRIPTA MATERIALIA, 2018, 146 :123-127

[4] Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices [J].

Chen, Chuantong ;

Nagao, Shijo ;

Suganuma, Katsuaki ;

Jiu, Jinting ;

Sugahara, Tohru ;

Zhang, Hao ;

Iwashige, Tomohito ;

Sugiura, Kazuhiko ;

Tsuruta, Kazuhiro .

ACTA MATERIALIA, 2017, 129 :41-51

[5] Review on Joint Shear Strength of Nano-Silver Paste and Its Long-Term High Temperature Reliability [J].

Khazaka, R. ;

Mendizabal, L. ;

Henry, D. .

JOURNAL OF ELECTRONIC MATERIALS, 2014, 43 (07) :2459-2466

[6] THE MECHANISM OF DENSIFICATION DURING SINTERING OF METALLIC PARTICLES [J].

KUCZYNSKI, GC .

ACTA METALLURGICA, 1956, 4 (01) :58-61

[7] Nano-volcanic Eruption of Silver [J].

Lin, Shih-kang ;

Nagao, Shijo ;

Yokoi, Emi ;

Oh, Chulmin ;

Zhang, Hao ;

Liu, Yu-chen ;

Lin, Shih-guei ;

Suganuma, Katsuaki .

SCIENTIFIC REPORTS, 2016, 6

[8] High-Temperature Die Attachment Using Sn-Plated Zn Solder for Power Electronics [J].

Park, Sungwon ;

Nagao, Shijo ;

Kato, Yoshitaka ;

Ishino, Hiroshi ;

Sugiura, Kazuhiko ;

Tsuruta, Kazuhiro ;

Suganuma, Katsuaki .

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2015, 5 (07) :902-909

[9] Microstructural stability of Ag sinter joining in thermal cycling [J].

Sakamoto, Soichi ;

Sugahara, Tohru ;

Suganuma, Katsuaki .

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2013, 24 (04) :1332-1340

[10] Low-temperature low-pressure die attach with hybrid silver particle paste [J].

Suganuma, K. ;

Sakamoto, S. ;

Kagami, N. ;

Wakuda, D. ;

Kim, K. -S. ;

Nogi, M. .

MICROELECTRONICS RELIABILITY, 2012, 52 (02) :375-380

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