机构:
Delft Univ Technol, Fac Elect Engn, DIMES, Lab Elect Instrumentat, NL-2628 CD Delft, NetherlandsDelft Univ Technol, Fac Elect Engn, DIMES, Lab Elect Instrumentat, NL-2628 CD Delft, Netherlands
French, PJ
[1
]
Sarro, PM
论文数: 0引用数: 0
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机构:
Delft Univ Technol, Fac Elect Engn, DIMES, Lab Elect Instrumentat, NL-2628 CD Delft, NetherlandsDelft Univ Technol, Fac Elect Engn, DIMES, Lab Elect Instrumentat, NL-2628 CD Delft, Netherlands
Sarro, PM
[1
]
机构:
[1] Delft Univ Technol, Fac Elect Engn, DIMES, Lab Elect Instrumentat, NL-2628 CD Delft, Netherlands
来源:
SMART STRUCTURES AND MATERIALS 1998: SMART ELECTRONICS AND MEMS
|
1998年
/
3328卷
关键词:
micromachining;
compatibility;
integration;
D O I:
10.1117/12.320198
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
In the fabrication of fully integrated sensors, which combine sensor and electronics on a single chip, it is essential to ensure that any additional process steps introduced for the sensor do not adversely affect the electronics. Where possible it is desirable to use existing processes or layers to fabricate the sensor. This is not always possible and therefore additional processing steps must be added to that of the electronic circuitry. In the fabrication of MEMS the additional processing is usually one of the forms of micromachining. Many processing steps are not compatible with the electronics and therefore they have to be adjusted which may lay considerable constraints on both materials and processing steps. In this paper the range of options to designer will be discussed.