共 30 条
[1]
Auberton-Herve A.J., 2002, Silicon Wafer Bonding Technology for VLSI and MEMS Applications
[6]
Beat the competition - A knowledge-based design process addressing the antenna effect and cell placement
[J].
IEEE CIRCUITS & DEVICES,
2004, 20 (03)
:18-27
[8]
Crnogorac F., 2009, IEEE INT 3D SY UNPUB
[10]
Wafer direct bonding with ambient pressure plasma activation
[J].
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS,
2006, 12 (05)
:397-400