Equivalent circuit modeling of board connectors

被引:0
作者
Diestel, H
Maas, BH
机构
[1] Fachhsch Osnabruck, D-49076 Osnabruck, Germany
[2] DeTeMobil GMBH, D-48155 Munster, Germany
关键词
SPICE-model; high-pincount board connector;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Equivalent circuits allow the analysis of interconnect components like board connectors in a circuit simulator where a full-wave analysis would require an unacceptably high computational effort. In this paper we present a method for developing a SPICE-model for a board connector embedded in a test setup. The equivalent circuits for the interconnect paths of the multilayer test boards are derived from measured time-domain reflectometry (TDR) waveforms. This technique is not suitable for components-with multiple couplings. Hence, the lumped circuit for the board connector is determined by using 2-D simulations. An efficient finite-difference method for calculating the per-unit-length capacitance and inductance matrices for straight and weakly curved multiconductor transmission lines is presented.
引用
收藏
页码:92 / 98
页数:7
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