Advanced bode plot techniques for ultrasonic transducers

被引:4
作者
DeAngelis, D. A. [1 ]
Schulze, G. W. [1 ]
机构
[1] Kulicke & Soffa Ind, Ultrason Grp, Mech Engn, 1005 Virginia Dr, Ft Washington, PA 19034 USA
来源
43RD ANNUAL UIA SYMPOSIUM | 2015年 / 63卷
关键词
Ultrasonic transducer; Wire bonding; Bode plots; Piezoelectric; PZT8; Vibrometer; Coupled-field FEA; ANSYS;
D O I
10.1016/j.phpro.2015.03.002
中图分类号
O42 [声学];
学科分类号
070206 ; 082403 ;
摘要
The Bode plot, displayed as either impedance or admittance versus frequency, is the most basic test used by ultrasonic transducer designers. With simplicity and ease-of-use, Bode plots are ideal for baseline comparisons such as spacing of parasitic modes or impedance, but quite often the subtleties that manifest as poor process control are hard to interpret or are nonexistence. In-process testing of transducers is time consuming for quantifying statistical aberrations, and assessments made indirectly via the workpiece are difficult. This research investigates the use of advanced Bode plot techniques to compare ultrasonic transducers with known "good" and known "bad" process performance, with the goal of a-priori process assessment. These advanced techniques expand from the basic constant voltage versus frequency sweep to include constant current and constant velocity interrogated locally on transducer or tool; they also include up and down directional frequency sweeps to quantify hysteresis effects like jumping and dropping phenomena. The investigation focuses solely on the common PZT8 piezoelectric material used with welding transducers for semiconductor wire bonding. Several metrics are investigated such as impedance, displacement/current gain, velocity/current gain, displacement/voltage gain and velocity/voltage gain. The experimental and theoretical research methods include Bode plots, admittance loops, laser vibrometry and coupled-field finite element analysis. (C) 2015 The Authors. Published by Elsevier B.V.
引用
收藏
页码:2 / 10
页数:9
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